Combination Shields

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The Evolution of EMI Technology Advancement

With the evolution of handset devices, space is at premium while feature and performance continually increase. As technology advances, more and more uses can be incorporated into one product. Laird Technologies offers a diverse product line of convergence technology, which offers two or more technologies combined into one convenient application. Combination products offer reduced part count, improved performance, and size reduction to benefit your designs, lower cost, and reduce time to market.

Some of Laird Technologies’ popular combination shields include Electrically Conductive Elastomer Backplane Shielding on board-level shields, which provides a low compression force frame gasket that achieves a low compression force by combining an electrically conductive elastomer layer over a low density foam insert. They are then mounted around the connectors of a backplane. The printed circuit board housing is then inserted into these connectors, thereby engaging the gaskets. Another popular product line includes the combination of a microwave absorber with board-level shielding that will absorb or suppress high frequency interference, enabling the board to be more effective at high frequencies. Yet another design includes the combination of custom head spreaders, thermal interface materials, heat transfers and board-level shielding. This combination transfers thermal energy while also offering EMI protection.

Laird Technologies is the only company that can affectively use a range of technologies to provide industry-leading solutions while being the complete source for all combination shielding solutions. Popular product lines include: T-BLS, A-BLS, EcE and Welded Fingers.

Contact Laird Technologies today for your complete application solutions.