Simple Installation and Flexibility for Grounding and Shielding Solutions
Laird Technologies’ tape products offer simple installation and are ideal for thin or low profile applications. The tape provides the flexibility of design for grounding and shielding solutions for I/O shielding panels, disk drive insulators, ground planes or circuit boards, electromedical devices and keyboard devices. The tape comes in a wide variety of materials to meet galvanic compatibility requirements.
High-Flex™ conductive fabric shielding tapes offer exceptional conformability and conductivity for dynamic flex applications. High-Flex™ tapes are constructed of Flectron™ nickel/copper metallized ripstop with a conductive pressure sensitive adhesive (PSA). This reliable tape design provides outstanding shielding performance while offering superior abrasion and corrosion resistance under high dynamic flex conditions.
Contact Laird Technologies today for your complete application solutions.
Downloads
Click on the downloads below to learn more about the product line.
EMI Electrically Conductive Adhesive Tape Technical Note Download
EMI Rough Surface Transfer Adhesive Tape Technical Note Download
EMI Transfer Adhesive Tape for Standard Products Technical Note Download
EMI Capabilities Brochure Download
EMI Essentials Catalog Download
EMI Product Solutions Brochure
Americas |
+1-866-928-8181 |
EMI-AmericasSales@lairdtech.com |
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Europe |
+49-(0)-8031-2460-0 |
United Kingdom +44-(0)-7795-037-522 |
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China |
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Korea |
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EMI-SingaporeSales@lairdtech.com |
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+886-2-2290-1234 |
EMI-TaiwanSales@lairdtech.com |
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